Polyurethane sealant, also known as PU sealant, is usually composed of polyols and diisocyanates of oligomers such as polyacetylates, polyethers, and polydialkenes, with diols or diamines as chain extenders, and gradually polymerized.

characteristic:

The characteristics of polyurethane sealing materials are low hardness, moderate strength, good elasticity, water resistance, mold resistance, shock resistance, transparency, excellent electrical insulation and flame retardancy, no corrosion to electrical components, and good adhesion to metals such as steel, aluminum, copper, tin, as well as rubber, plastic, wood and other materials. Encapsulation materials can protect installed and debugged electronic components and circuits from the effects of vibration, corrosion, moisture, and dust.

Advantages:

Polyurethane sealant can cure at room temperature, avoiding damage and performance degradation of electronic and electrical components caused by temperature rise during heating curing. Due to the curing process at room temperature without the need for large heating and curing equipment, it is an ideal sealing material for moisture-proof and corrosion-resistant treatment of electronic and electrical components.

Filled PU Potting 

1、 Product Introduction:

Polyurethane sealant is developed for long-term protection of precision circuit controllers and components in the electronic industry. Excellent electrical insulation, especially suitable for sealing electronic circuit boards and components used in harsh environments such as humidity, vibration, and corrosion.

2、 Application areas:

Suitable for sealing various electronic components, microcomputer control boards, etc., such as fuzzy controllers for washing machines, pulse igniters for gas water heaters, induction sanitary ware controllers, electric bicycle drive controllers, etc.

3、 Operation process:

1. Preheating: Place the poured components in an oven of around 60 ° C for 1-2 hours to remove moisture from the components;

2. Mixing: Weigh a certain amount of material A, then add material B in proportion and stir evenly in a mixing container;

3. Defoaming: Vacuum defoaming of the mixture (note: a small amount of bubbles remaining on the surface of the adhesive before stopping vacuuming is a normal phenomenon and will naturally disappear under normal pressure);

4. Pouring: Pour the defoamed mixture into the device to be poured, and it can be completely cured at 23 ℃/3-4 hours.

4、 Storage, transportation and precautions:

1. This product is a non hazardous material and is stored and transported as a general chemical. The production date of the product can be found in the packaging drum.

2 A. Component B should be sealed and stored. If it is not used up after opening, please reseal the lid and seal it.

3. During the gluing process, mixing containers, stirring tools, etc. should avoid contact with water and moisture.

4. During use, the spilled glue can be cleaned with solvents such as acetone, ethyl acetate, dichloromethane, etc., but the solvents should not be mixed into unused A and B glue or already sealed glue.

5、 Packaging specifications:

Material A is packaged in iron drums, 20KG per drum; B material is packaged in iron drums, 16KG per drum.

Note: The above performance parameters are typical data tested for this product at a humidity of 70% and a temperature of 23 ℃. They are for reference only when used by customers and cannot fully guarantee that all data can be achieved in a specific environment. Please use actual test data when using it.